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Meyer Burger Receives Order For 3 Diamond Wire Cutting Technology

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Meyer Burger Technology has announced that it has concluded an important contract for its industry leading DW 288 Series 3 diamond wire cutting platform. The existing European customer selected Meyer Burger’s newest generation diamond wire cutting technology in order to increase its production volume of high quality solar wafers at sustainably reduced manufacturing costs.

The contract volume is about CHF 8 million and includes the delivery, installation and commissioning as well as service support and on-site training for the DW 288 Series 3 diamond wire cutting platform. Delivery of the equipment is expected to start as of the second quarter 2017.

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