News Article

New Solder Paste From Heraeus


Heraeus Electronics, a leading provider of materials
solutions, has developed Microbond SMT650, its new solder paste that meets the
extremely high requirements for the production of miniaturized electrical
systems, such as those used in the automotive industry. Microbond SMT650 guarantees consistently high
surface resistance. The combination of the new F650 flux system with the
Innolot metal alloy increases reliability and prevents electrochemical
migration even under the most extreme environmental conditions.

Cars today are rolling technology giants. To accommodate all
the electronics necessary means that individual components must be smaller than
ever. Miniaturization - and the corresponding ever shrinking distances between
the conductor paths - lead to higher electrical field strengths. This increases
the risk of electrochemical migration. The solution to this problem is the new
solder paste Microbond SMT650, the latest addition to the successful Microbond
solder paste family.

The right chemistry for greater reliability

Electrochemical migration, a form of corrosion, affects the
reliability and service life of electronic assemblies. The phenomenon is caused
by moisture - either during the manufacture of printed circuit boards or due to
external influences. An example of this is the control unit in a vehicle, where
temperature fluctuations can lead to condensation. The moisture deposited on
the printed circuit boards, in combination with flux residues and increased
electric field strength, can lead to negative interactions. So-called dendrites
form and can ultimately lead to a short circuit.

To prevent this, Heraeus Electronics has developed its new
solder paste Microbond SMT650. With its unique material composition, Microbond
SMT650 offers a consistently high surface resistance that prevents the risks of
electrochemical migration. The chemical composition of the new flux is decisive
here. “With the F650 flux system, we have found a very good balance between
wetting under nitrogen reflow, excellent pressure properties, and surface
resistance,” explains Manu Noé Vaidya, Product Manager at Heraeus Electronics.

In addition, Microbond SMT650 is compatible with many
protective lacquers for electronics and printed circuit boards. The specially
developed F650 flux system can be combined with a variety of alloys. The
patented Innolot alloy is intended for applications with high requirements,
such as in the automotive sector. Innolot contains various metals that increase
the service life of the entire electronic assembly through their high
thermomechanical stability. In other words, this means longer use at higher
temperatures. “For applications with low thermomechanical requirements, Heraeus
offers the Microbond SMT650 solder paste with a tin-silver-copper alloy (SAC). This means customers need only minimal effort
to qualify which product is best for their application,” says Product Manager
Manu Noé Vaidya.

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