News Article
Technic Releases Reduced Silver Plating Process
Manufacturers to plate up to 30% faster
Technic has released TechniSol Ag 2460, a cyanide free silver plating solution formulated specifically for use with RSP (Reduced Silver Paste) Technology on silicon solar cells.
RSP Technology applies a fine line screen printed seed layer that is then electroplated with a smooth silver layer, resulting in increased efficiencies at a significantly reduced cost. The bath operates at 20 g/l silver, a concentration similar to most other baths in the industry, but because of key advances in its formulation TechniSol Ag 2460 produces very fine grain deposits with no lateral growth. This improved electrolyte formulation also allows manufacturers to plate up to 30% faster and still maintain optimum deposit integrity.
In addition to the advantages in RSP Technology, TechniSol Ag 2460 may be used to plate on nickel or copper grid lines, and is also formulated for compatibility with LIP (Light Induced Plating) as well as standard electroplating applications.
