News Article
Tegal Ships Again
The company ships deep silicon etch system following the acquisition of Alcatel Micro Machining System (AMMS) product line.
Tegal Corporation, a designer and manufacturer of plasma etch and deposition systems, announced that the company had shipped a deep reactive ion etch (DRIE) system to a supplier of substrates and services in the integrated circuit and MEMS sensor markets. The new Tegal DRIE system is currently being installed at the customer's 150mm production foundry.
“Tegal is very pleased to have shipped our first Tegal silicon etch system following our acquisition of the AMMS product lines in September, said Thomas Mika, President and CEO of Tegal Corporation. “We worked very hard to make the sales and qualification process seamless for our customer, who has added Tegal's DRIE system to its existing tool set. The fact that this customer has made the choice for Tegal, after working in MEMS production for many years, is a strong endorsement of the Tegal / AMMS track record for production proven performance.”
The system is a high density plasma etch tool featuring an inductively coupled plasma etch reactor and magnetic plasma confinement. The tool can achieve etched feature aspect ratios of > 100:1 in production environments. Together with its high reliability, broad process window, and high etch rates, the system is a critical enabler for etching the silicon and SOI substrates found in the MEMS/MOEMS, photovoltaic, bio-tech and hi-voltage markets.
“Tegal is very pleased to have shipped our first Tegal silicon etch system following our acquisition of the AMMS product lines in September, said Thomas Mika, President and CEO of Tegal Corporation. “We worked very hard to make the sales and qualification process seamless for our customer, who has added Tegal's DRIE system to its existing tool set. The fact that this customer has made the choice for Tegal, after working in MEMS production for many years, is a strong endorsement of the Tegal / AMMS track record for production proven performance.”
The system is a high density plasma etch tool featuring an inductively coupled plasma etch reactor and magnetic plasma confinement. The tool can achieve etched feature aspect ratios of > 100:1 in production environments. Together with its high reliability, broad process window, and high etch rates, the system is a critical enabler for etching the silicon and SOI substrates found in the MEMS/MOEMS, photovoltaic, bio-tech and hi-voltage markets.
