Heraeus to Showcase new pastes at intersolar/PVSEC event.
Heraeus Photovoltaics, the worldwide leading supplier of metallization solutions to the PV industry, will be showcasing its newest metallization pastes at the intersolar/PVSEC trade show and R&D conference, which will take place June 22-24, 2016, in Munich, Germany. Exhibiting in Hall 2, Booth 440, Heraeus will be promoting its newest metallization pastes for PERC-solar cells as well as for low-temperature heterojunction and organic solar cell applications.
The new PERC-products are part of a PERC package. It includes the SOL9631, a low-temperature front-side paste and the SOL326, a low-activity back-side silver tabbing paste. The SOL9631 paste can be fired at low temperatures, making it specifically suitable for PERC solar cells. The densified microstructure of the fired finger, including the Ag-Silicon interface, enhances adhesion, grid resistivity and solderability and reduces light-introduced-degradation (LID) loss to be similar as a normal P-type module.
The unique properties of the SOL326 series provide less fire-through/penetration into the passivation and better protects the emitter during the metallization process. The SOL326 series provides greater performance in key areas including cell efficiencies over 20%, higher aged adhesion, improved Voc and increased module reliability.
Both products feature a unique glass chemistry, exclusively developed and produced by Heraeus. They enable customers and partners of Heraeus to produce PERC cells with significant higher cell efficiency, improved adhesion and enhanced module reliability.
For emerging solar cell architectures of third-generation PV Heraeus markets the new SOL500 series, formulated for the processing of solar cell types which cannot withstand high firing temperatures. The SOL560 is designed for the curing temperature range of less than 200°C for heterojunction solar cells, the SOL530 accommodates the 125-135°C range required in the production of organic solar cells. Both pastes show an excellent adhesion on ITO or other TCO materials and provide PV cell manufacturers with improved printability and adhesion, excellent line conductivity and minimal pinholes.
